Fine pitch (4.5 um) pixel architecture for the best resolution in a compact package.
87% fill-factor for high brightness.
VAN-mode LC technology for superior contrast and viewing angle.
Proprietary spacer-less gap control (< 1/2 fringe) process for corner-to-corner display color uniformity.

Proprietary wafer-scale process for industry-leading yield.
Access to no-markup LCoS packaging and product assembly facility.
Integrated mixed-signal driver chip.

Color sequential (up to 360 fps) or multi-panel configurable.
2D - 3D switchable.
Highly scalable, low pin-count, mixed-signal architecture.
4k2k (0.82" 8M pixel) color sequential demo shown at the 2012 International CES.
8k4k under development.